{"id":1680,"date":"2026-03-23T13:42:00","date_gmt":"2026-03-23T12:42:00","guid":{"rendered":"https:\/\/thinex.tech\/proyecto\/logipack\/"},"modified":"2026-03-23T14:34:55","modified_gmt":"2026-03-23T13:34:55","slug":"logipack","status":"publish","type":"proyecto","link":"https:\/\/thinex.tech\/en\/proyecto\/logipack\/","title":{"rendered":"LOGIPACK"},"content":{"rendered":"
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Printed Electronics Projects<\/strong><\/h1>\n\t\t\n\t\t\t\t\t


Our dedication to innovation is unwavering, as reflected in the R&D projects<\/strong> in which we participate. These projects allow us to develop unique and customized solutions for a wide range of applications and markets, enabling us to stay at the forefront of printed electronics. <\/p>\n\t\t\n\t\t\t<\/div>\n<\/section>\n\n

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LOGIPACK<\/h1>\n\n\n\n

Research and development of smart objects based on embedded RFID tags and a Logic Platform for an interconnected industry based on the Digital Product Passport<\/strong><\/h2>\n\n\n\n
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Project Objective<\/strong>The LOGIPACK project aims to develop an advanced traceability platform that connects the physical product with its digital twin, laying the foundation for the Digital Product Passport (DPP)<\/strong> required by European regulations. The solution improves the transparency, sustainability, and efficiency of the supply chain throughout the entire product lifecycle. <\/p>\n\n\n\n

\"Logipack<\/figure>\n\n\n\n
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Consortium Capabilities<\/strong>The consortium brings together industrial and technology companies and research centers with expertise in printed electronics<\/strong>, RFID, advanced manufacturing, IoT, blockchain, and information systems. Thinex is involved in the development of printed RFID antennas and scalable industrial processes, integrating functional electronics directly into plastic products using technologies such as In-Mold Electronics. <\/p>\n\n\n\n

\"Logipack<\/figure>\n\n\n\n
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Solution to the challenge<\/strong>LOGIPACK addresses the current limitations of traceability, which is based on unreliable external labels and disconnected systems. The solution proposes: <\/p>\n\n\n\n

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  • integration of RFID antennas printed<\/strong> directly onto the product, creating a unique and permanent identifier,<\/li>\n\n\n\n
  • bidirectional connection between the physical object and its digital representation,<\/li>\n\n\n\n
  • and an interoperable platform that manages product lifecycle data in real time.<\/li>\n<\/ul>\n\n\n\n

    This allows a shift from batch-level traceability to individualized traceability, which is more precise, reliable, and aligned with DPP requirements.<\/p>\n\n\n\n

    Project Scope<\/strong>The project includes:<\/p>\n\n\n\n

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    • development of UHF RFID antennas using printed electronics on plastic substrates,<\/li>\n\n\n\n
    • integraci\u00f3n de TAGs en piezas mediante procesos de inyecci\u00f3n (IME),<\/li>\n\n\n\n
    • design of an interoperable digital platform connected to ERP, WMS and external systems,<\/li>\n\n\n\n
    • Implementation of IoT, blockchain, and artificial intelligence architectures for data management,<\/li>\n\n\n\n
    • and validation in real production and logistics environments.<\/li>\n<\/ul>\n\n\n\n

      Ecodesign criteria are also incorporated to ensure product recyclability and compatibility with circular economy models.<\/p>\n\n\n\n

      Expected Outcome<\/strong>The expected results of the project include:<\/p>\n\n\n\n

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      • and the consolidation of printed electronics<\/strong> as a key technology for smart and connected products.<\/li>\n\n\n\n
      • complete and real-time traceability at the individual product level,<\/li>\n\n\n\n
      • Significant improvement in logistics management, reduction of errors and losses,<\/li>\n\n\n\n
      • Enabling the Digital Product Passport in accordance with European regulations,<\/li>\n\n\n\n
      • generation of new data-based services (predictive maintenance, quality control, etc.),<\/li>\n<\/ul>\n\n\n
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        \"Logipack<\/figure>\n<\/div><\/div>\n\n\n\n
        <\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"

        LOGIPACK Research and development of smart objects based on embedded RFID tags and a Logic Platform for an interconnected industry based on the Digital Product Passport Project ObjectiveThe LOGIPACK project aims to develop an advanced traceability platform that connects the physical product with its digital twin, laying the foundation for the Digital Product Passport (DPP) […]<\/p>\n","protected":false},"featured_media":1678,"template":"","class_list":["post-1680","proyecto","type-proyecto","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/thinex.tech\/en\/wp-json\/wp\/v2\/proyecto\/1680","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/thinex.tech\/en\/wp-json\/wp\/v2\/proyecto"}],"about":[{"href":"https:\/\/thinex.tech\/en\/wp-json\/wp\/v2\/types\/proyecto"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/thinex.tech\/en\/wp-json\/wp\/v2\/media\/1678"}],"wp:attachment":[{"href":"https:\/\/thinex.tech\/en\/wp-json\/wp\/v2\/media?parent=1680"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}