EMI

Intelligent metal structures using electronic sensor printing

Project Objective
The EMI project aimed to develop electromagnetic shielding (EMI) solutions based on printed electronics, designed to protect electronic devices and systems from electromagnetic interference, while maintaining lightweight, flexible, and easily integrated designs.

Consortium Capabilities
The consortium combined expertise in functional materials, electromagnetic compatibility, and printed electronics processes, enabling the design and manufacture of printed conductive layers tailored to various industrial applications.

Solution to the challenge
Traditional EMI shielding solutions often involve rigid, heavy materials or complex manufacturing processes. The EMI project addressed this challenge by using conductive inks printed on flexible substrates, enabling the creation of functional patterns that attenuate electromagnetic interference without compromising weight, thickness, or design freedom.

Project Scope
The work included the development and validation of printed shielding structures, compatible with industrial processes and applicable to different surfaces and geometries. Their behavior in the face of electromagnetic interference and their integration into real electronic systems were evaluated.

Expected Outcome
The expected results of the project include:

• Improved protection against electromagnetic interference.
• Weight and volume reduction compared to conventional solutions.
• Easier integration into complex electronic products.
• Consolidation of printed electronics as a viable technology for advanced electromagnetic compatibility solutions.